Hernon Tuffbond 305 is a rapid cure epoxy adhesive that cures at room temperature. Tuffbond 305 exhibits very good moisture, chemical, and heat resistance. Tuffbond 305 is recommended for bonding metals, wood, ceramics, and other materials, and can be used for potting and encapsulation of electrical and electronic components. Tuffbond 305 is also particularly useful for the rapid in-line assembly of loud speakers.